Coverart for item
The Resource Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing, Sheng Liu, Yong Liu, (electronic resource)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing, Sheng Liu, Yong Liu, (electronic resource)

Label
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing
Title
Modeling and simulation for microelectronic packaging assembly
Title remainder
manufacturing, reliability and testing
Statement of responsibility
Sheng Liu, Yong Liu
Creator
Contributor
Subject
Genre
Language
eng
Summary
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Assigning source
Provided by publisher
Cataloging source
CaPaEBR
http://library.link/vocab/creatorDate
1963-
http://library.link/vocab/creatorName
Liu, S.
Illustrations
  • illustrations
  • charts
Index
index present
Literary form
non fiction
Nature of contents
  • standards specifications
  • bibliography
http://library.link/vocab/relatedWorkOrContributorDate
1962-
http://library.link/vocab/relatedWorkOrContributorName
  • Liu, Yong
  • ebrary, Inc
http://library.link/vocab/subjectName
Microelectronic packaging
Label
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing, Sheng Liu, Yong Liu, (electronic resource)
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Color
multicolored
Contents
pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging
Control code
ebr10494525
Dimensions
unknown
Extent
xxii, 564 p.
Form of item
electronic
Other physical details
ill
Reproduction note
Electronic reproduction.
Specific material designation
remote
System control number
(OCoLC)756280855
Label
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing, Sheng Liu, Yong Liu, (electronic resource)
Publication
Bibliography note
Includes bibliographical references and index
Color
multicolored
Contents
pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging
Control code
ebr10494525
Dimensions
unknown
Extent
xxii, 564 p.
Form of item
electronic
Other physical details
ill
Reproduction note
Electronic reproduction.
Specific material designation
remote
System control number
(OCoLC)756280855

Library Locations

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      32.771354 -117.193327
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